Teledyne EMS strives to establish Long Term Partnerships through Cost Competitive Gains by using the Latest Technology Innovations.

Five SMT Lines BGA Placement to 55 mil square Fine Pitch to 16 mil, 0.5 mm BGA 0201 Component Placement Inline X-ray and AOI Mixed Technology Full Capability for Legacy Products Radial, Axial and IC/DIP Insertion Equipment Box and Subassembly Builds Flexible Cell Layout to Adapt Product Flow Complete Electro-mechanical Integration for Plug and Play Application Coating and Bonding AR, UR and Silicone Conformal Coat BGA Underfill Multiple Processes available for Bonding Operations Full Spectrum Test Flying Probe, ICT, Functional, Thermal and Vibration Test Development – Fixturing and Software Solutions Depot Level Repair and Testing